Highlights
Objective
To be successful, with affirmative approach to handle my responsibilities with zeal and the full application of my knowledge that possess to work as a team and stand up to the expectation of the concern
EXPERIENCE SUMMARY
- Schematic Design, aware about the Polarized Components & Effective Utility of Heterogeneous part, Trouble shoots error and Net-list Extraction
- Schematic symbols are created as per the IEEE standards
- PCB footprints as per the IPC-7351B standards
- Footprint created as per Customer defined guidelines
- Designing of Single, Double & Multilayer PCBs
- Critical Components Placement with proper guideline standard
- Knowledge in DFA, DFM and DFT
- Take care about EMI and EMC
- Take care to maintain Signal Integrity
- Knowledge of Impedance Matching based on the Layer Stack-Up Structure
- Aware about Signal Parallelism
- Better Plan to run Critical Signals with separate & shielded Ground-Reference
- Maintain the Balanced Copper density in each individual layer
- Advanced knowledge of constraints set
- Expertise in usage of Blind & Buried vias
- Layout translation Schematic translation
- Knowledge of scripting and Documentation
HIGHTLIGHTS AND SKILLS
- Used advanced HDI concept like blind and buried via.
- Worked with multiple BGA designs (0.5 mm,0.65 mm,0.8 mm)
- Work experience with high-speed interfaces like DDR3, DDR4, HDMI, PCIe, USB, Ethernet RJ45, LVDS,QSFP,OCULINK,CAPI,M2 and SATA
- Designed PCB layouts for high frequency operations designs.
- Gained good knowledge of Google, Intel, Analog Devices, and IBM symbol/PCB land pattern standards.
- Worked with PCB reverse engineering concepts.
- Must be able to work on many different projects at one time and be results oriented
- Expertise in Signal Grouping, Pin-Pair settings & Length Matching for DDR Memory Slot
- Experience in Gerber Analyze & Net-list compare and Analyze in CAM350