Highlights

Objective

To be successful, with affirmative approach to handle my responsibilities with zeal and the full application of my knowledge that possess to work as a team and stand up to the expectation of the concern

EXPERIENCE SUMMARY

• Schematic Design, aware about the Polarized Components & Effective Utility of Heterogeneous part, Trouble shoots error and Net-list Extraction


• Schematic symbols are created as per the IEEE standards


• PCB footprints as per the IPC-7351B standards


• Footprint created as per Customer defined guidelines


• Designing of Single, Double & Multilayer PCBs


• Critical Components Placement with proper guideline standard


• Knowledge in DFA, DFM and DFT


• Take care about EMI and EMC


• Take care to maintain Signal Integrity


• Knowledge of Impedance Matching based on the Layer Stack-Up Structure


• Aware about Signal Parallelism


• Better Plan to run Critical Signals with separate & shielded Ground-Reference


• Maintain the Balanced Copper density in each individual layer


• Advanced knowledge of constraints set


• Expertise in usage of Blind & Buried vias


• Layout translation  Schematic translation


• Knowledge of scripting and Documentation

HIGHTLIGHTS AND SKILLS

• Used advanced HDI concept like blind and buried via.


• Worked with multiple BGA designs (0.5 mm,0.65 mm,0.8 mm)


• Work experience with high-speed interfaces like DDR3, DDR4, HDMI, PCIe, USB, Ethernet RJ45, LVDS,QSFP,OCULINK,CAPI,M2 and SATA


• Designed PCB layouts for high frequency operations designs.


• Gained good knowledge of Google, Intel, Analog Devices, and IBM symbol/PCB land pattern standards.


• Worked with PCB reverse engineering concepts.


• Must be able to work on many different projects at one time and be results oriented


• Expertise in Signal Grouping, Pin-Pair settings & Length Matching for DDR Memory Slot


• Experience in Gerber Analyze & Net-list compare and Analyze in CAM350

Skills

Primary Skills

Altium

CAM 350

Secondary Skills

Allegro

Projects

(NX0503_385A-SOC)

Description





This is the 385A-SoC System on Chip FPGA Accelerator Card






• 16 Layers with the size of 6.5”X3"


• Total number of Components 1002


• Altera Arria 10 SX F34 package


• Main Processor BGA with 1152pins


• 2 Banks 4G DDR4 SDRAM


• 8-Lane PCI-Express Gen 3






Challenges, Technologies used






• 1mmpitch BGA Fan-out and Trace Out all signals in 8 Layers


• Length matching the DDR4 in Daisy Chain topology routing method for Address lines


• Narrow edge routing path to avoid stub, Proper Shield to avoid noise


• DDR4 Interface Routings, PCIe Express Interface


• It has lot of powers and impedances are used (12v,5v,3.3v,3v,2.5v,1.8v,1.2v ,0.9v,0.6v and40ohms, 50 ohms, 90 ohms, 95 ohms, 100 ohms)






Role & Contribution






• Lane Grouping & Length Matching and Mechanical check as per DXF






Tools& Gerber Verification






• Altium Designer 17.1 & CAM350

BR02-1180-01

Description






• This is the memory and data transfer card


• 16 Layers with the size of 5.6”X4.4”


• Total Number of components 1447


• Main Processor BGA with 780pins


• DDR4 Module


• ETHERNET 1G PHY INTERFACES


• QSGMI ETHERNET PHY


• NOR FLASH


• ETHERNET QUAD MAGNETICS


• RMI HIGH-SPEED CONNECTOR


• RF BOARD Connectors


• FRONT PANEL CONNECTOR


• REAR CONNECTOR






Challenges, Technologies used






• High Density Board with Critical Placement Constraint


• Fine pitch component 0.65mm Used


• High speed signal routing and length tuned


• Power plane handling


• It has lot of powers and impedances are used (12v,5v,3.3v,2.5v,1.8v,1.2v,1.1v,1.0v and 50ohms, 75 ohms, 85 ohms,100 ohms)






Role & Contribution






• Creating Board Outline with Mechanical Spec, Placement


• Constraint setup and Fanout


• Length matching and report added


• Fabrication setup


• Gerber generation and Cam verification






Tools






• Cadence Allegro 17.2, OrCAD Capture CIS

(NT-520N-MX)

Description





This is the High performance compute node featuring 3Dstacked High Bandwidth Memory (HBM2) and choice of external memory DIMMs






• 16 Layers with the size of 10.5”X3.87”


• Total number of components 1723


• Main Processor Stratix 10 FPGA with 2597pins


• DDR4 DIMM


• MAX10 FPGA


• USB 2.0 Micro USB


• Flash Memory


• PCI edge fingers


• QSFP28 Connectors


• PCIE_OCULINK Connectors


• 25G_OCULINK Connectors






Challenges, Technologies used






• High Density Board with Critical Placement Constraint


• Fine pitch component 0.5mm and 0.65 mm used


• High speed signal routing and length tuned


• PMIC Power fanout and power plane handling


• It has lot of powers and impedances are used (VCC_CORE -0.9v and(125A),12v,3.3v,2.5v,1.8v,1.2v and 40ohms, 80 ohms, 85 ohms, 90 ohms, 100 ohms)






Role & Contribution






• Constraint setup and Fanout


• Length matching and report added


• Fabrication setup


• Gerber generation and Cam verification






Tools






• Altium Designer 17.1 & CAM350